Grantia

Lab to Fab Accelerators for Advanced Packaging and heterogeneous integration

Funding to accelerate the transfer of advanced semiconductor packaging and heterogeneous integration technologies from pilot lines to industrial deployment, targeting European-based companies, research organizations, and value chain actors to strengthen the continent’s competitiveness and supply chain resilience.

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Details

Agency

EU Commission

Status

Upcoming

Language

English

Funding Type

Grant

Funding Amount

Up to 15.0M €

Deadline

2026-02-25

Open Date

2025-12-03

Overview

Funding to accelerate the transfer of advanced semiconductor packaging and heterogeneous integration technologies from pilot lines to industrial deployment, targeting European-based companies, research organizations, and value chain actors to strengthen the continent’s competitiveness and supply chain resilience.

Who Can Apply

Consortia of legal entities established in eligible countries, including semiconductor packaging companies, research and technology organizations (RTOs), equipment and material providers, and end-users. Single applicants are not eligible.

Funding Details

Maximum grant amount: 15,000,000 EUR per project. Total budget and funding rate are not specified.

What Is Funded

  • Development and industrialization of advanced packaging and heterogeneous integration technologies.
  • Expansion of the European semiconductor packaging ecosystem.
  • Collaboration across the value chain, including materials, substrates, equipment, test providers, packaging companies, and customers.
  • Technology transfer from pilot lines to industrial deployment.

Technology / Maturity Requirements

Projects must build on existing pilot line services and focus on scaling technologies toward industrial readiness. Specific Technology Readiness Level (TRL) ranges are not provided.

Key Dates

  • Open date: 2025-12-02
  • Deadline: 2026-02-24

Application Process (High-Level)

Single-stage submission via the Funding & Tenders Portal. Proposals must adhere to page limits and formatting requirements outlined in Part B of the Application Form.

Geographic Scope & Language

Eligible countries: EU Member States and associated countries (specific list not provided). Application language: English.

Notes

Proposals must demonstrate involvement of relevant value chain actors and contribute to resilient European supply chains. Detailed eligibility, evaluation criteria, and financial conditions are available in the Chips JU Work Programme and call documents.